ESD Protection Diodes support USB 3.0/3.1 and HDMI interfaces.

Feature Low Capacitance, Deliver Excellent ESD Protection Performance

Toshiba America Electronic Components, Inc. (TAEC)* today announced that it has introduced a new lineup of multi-bit, low-capacitance electrostatic discharge (ESD) protection diodes[1] for high-speed interfaces. Suitable for use in mobile devices, including smart phones, tablets and wearable devices, the new diodes deliver excellent protection performance and support interfaces including USB 3.0/3.1 and HDMI. The new devices simultaneously deliver low capacitance, low dynamic resistance and high ESD endurance. Minimum signal distortion of high-speed data signals is guaranteed by the ultra-low capacitance of 0.2pF, while a typical dynamic resistance of RDYN=0.5Ω ensures low clamping voltages. High ESD protection levels are supported by electrostatic discharge voltages of at least ±20 kV according to IEC61000-4-2.

The continuous growth of data traffic – driven by smart phones, wearables and applications such as virtual reality and the internet of things – has led to increasing numbers of high-speed interfaces that need to be protected from ESD events. Toshiba's new lineup of ESD protection diodes consists of five products for 3.3V signal lines and five products for 5.0V signal lines, allowing design engineers to select the appropriate match for the interface voltage of their device. The new diodes are fabricated with Toshiba's newly developed EAP-IV process[2], which utilizes Toshiba's proprietary snapback technology. This improves dynamic resistance, which absorbs ESD and noise, by approximately 50 percent compared to Toshiba's existing products[3]. ESD voltage is improved by approximately 75 percent when compared to existing products[3], which can contribute to system reliability improvements.

The new lineup of ESD protection diodes is available in three different package sizes to meet mounting space requirements. The small SOD-962 package is suitable for multi-port applications that are expected to grow, such as USB Type-C™[4]; the flow-through DFN10 (2.5×1.0mm) package can reduce the inductance of wires; and the SOD-882 (CST2) (1.0×1.6mm) package can contribute to slimmer, smaller devices.

Main Specifications(@Ta=25°C)

Part            Internal          Absolute                 Working peak       Dynamic         Clamp voltage         Total capacitance       Package (Toshiba's 
number      connection   maximum ratings     reverse voltage    resistance        VC typ. (V)              Ct typ. @VR=0V,        package name)
                                       Electrostatic           VRWM max (V)    RDYN typ.(Ω)     @ITLP      @ITLP      f=1MHz (pF)  
                                        discharge                                                                       =16A            =30A
                                       VESD (kV)

DF2B5M4SL     Bi-              ±20                           3.6                   0.5                     17             24              0.2                      SOD-962 (SL2) DF2B5M4CT   direction                                                                                                                                                       SOD-882 (CST2)

DF2S5M4SL    Single-                                                                   0.3                    14             18.5           0.35                    SOD-962 (SL2) DF2S5M4CT   direction                                                                                                                                                        SOD-882 (CST2)

DF5G5M4N       Bi-                                                                       0.5                     17               24             0.2                        DFN5
F10G5M4N      direction                                                                                                                                                          DFN10

DF2B6M4SL                                                        5.5                   0.5                      18               25             0.2                     SOD-962 (SL2) DF2B6M4CT                                                                                                                                                                         SOD-882 (CST2)

DF2S6M4SL     Single-                                                                0.3                       14              18             0.35                   SOD-962 (SL2)
DF2S6M4CT    direction                                                                                                                                                       SOD-882 (CST2)

DF5G7M2N      Bi-                                                                      1.0                        36               50             0.2                         DFN5
DF5G6M4N   direction                                                                0.5                        18               25             0.2                        DFN10
DF10G6M4N

Pricing and availability

The new ESD protection diodes are available now. For more details, samples and pricing information, please contact your local Toshiba Sales Office.

About TAEC

Through proven commitment, lasting relationships and advanced, reliable electronic components, Toshiba enables its customers to create market-leading designs. Toshiba is the heartbeat within product breakthroughs from OEMs, ODMs, CMs, VARs, distributors and fabless chip companies worldwide. A committed electronic components leader, Toshiba designs and manufactures high-quality flash memory-based storage solutions, solid state drives (SSDs), hard disk drives (HDDs), solid state hybrid drives (SSHDs), discrete devices, custom SoCs/ASICs, imaging products, microcontrollers, wireless components, mobile peripheral devices, and advanced materials that make possible today's leading smartphones, tablets, cameras, medical devices, automotive electronics, industrial applications, enterprise solutions and more.

Toshiba America Electronic Components, Inc. is an independent operating company owned by Toshiba America, Inc., a subsidiary of Toshiba Corporation, Japan's largest semiconductor, solid state drive and hard disk drive manufacturer and the world's seventh largest semiconductor manufacturer (Gartner, 2015 Worldwide Semiconductor Revenue, January, 2016).

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