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XC6SLX100-3FGG676C

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FPGA SPARTAN-6 LX FAMILY 101261 CELLS 45NM (CMOS) TECHNOLOGY - Trays BGA-676

Fabbricante : AMD Xilinx, Inc
Pacchetto : BGA-676
Tipologia di produzione : FPGAs
Datasheet: XC6SLX100-3FGG676C Datasheet (PDF)
RoHs Status: Lead free/RoHS Compliant
Stock: 100

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XC6SLX100-3FGG676C Dettagli del prodotto

The Spartan®-6 family provides leading system integration capabilities with the lowest total cost for high-volume applications. The thirteen-member family delivers expanded densities ranging from 3,840 to 147,443 logic cells, with half the power consumption of previous Spartan families, and faster, more comprehensive connectivity. Built on a mature 45 nm low-power copper process technology that delivers the optimal balance of cost, power, and performance, the Spartan-6 family offers a new, more efficient, dual-register 6-input lookup table (LUT) logic and a rich selection of built-in system-level blocks. These include 18 Kb (2 x 9 Kb) block RAMs, second generation DSP48A1 slices, SDRAM memory controllers, enhanced mixed-mode clock management blocks, SelectIO™ technology, poweroptimized high-speed serial transceiver blocks, PCI Express® compatible Endpoint blocks, advanced system-level power management modes, auto-detect configuration options, and enhanced IP security with AES and Device DNA protection. These features provide a lowcost programmable alternative to custom ASIC products with unprecedented ease of use. Spartan-6 FPGAs offer the best solution for high-volume logic designs, consumer-oriented DSP designs, and cost-sensitive embedded applications. Spartan-6 FPGAs are the programmable silicon foundation for Targeted Design Platforms that deliver integrated software and hardware components that enable designers to focus on innovation as soon as their development cycle begins.

XC6SLX100-3FGG676C

Caratteristica

  • Spartan-6 Family:
    • Spartan-6 LX FPGA: Logic optimized
    • Spartan-6 LXT FPGA: High-speed serial connectivity
  • Designed for low cost
    • Multiple efficient integrated blocks
    • Optimized selection of I/O standards
    • Staggered pads
    • High-volume plastic wire-bonded packages
  • Low static and dynamic power
    • 45 nm process optimized for cost and low power
    • Hibernate power-down mode for zero power
    • Suspend mode maintains state and configuration with multi-pin wake-up, control enhancement
    • Lower-power 1.0V core voltage (LX FPGAs, -1L only)
    • High performance 1.2V core voltage (LX and LXT FPGAs, -2, -3, and -3N speed grades)
  • Multi-voltage, multi-standard SelectIO™ interface banks
    • Up to 1,080 Mb/s data transfer rate per differential I/O
    • Selectable output drive, up to 24 mA per pin
    • 3.3V to 1.2V I/O standards and protocols
    • Low-cost HSTL and SSTL memory interfaces
    • Hot swap compliance
    • Adjustable I/O slew rates to improve signal integrity
  • High-speed GTP serial transceivers in the LXT FPGAs
    • Up to 3.2 Gb/s
    • High-speed interfaces including: Serial ATA, Aurora, 1G Ethernet, PCI Express, OBSAI, CPRI, EPON, GPON, DisplayPort, and XAUI
  • Integrated Endpoint block for PCI Express designs (LXT)
  • Low-cost PCI® technology support compatible with the 33 MHz, 32- and 64-bit specification.
  • Efficient DSP48A1 slices
    • High-performance arithmetic and signal processing
    • Fast 18 x 18 multiplier and 48-bit accumulator
    • Pipelining and cascading capability
    • Pre-adder to assist filter applications
  • Integrated Memory Controller blocks
    • DDR, DDR2, DDR3, and LPDDR support
    • Data rates up to 800 Mb/s (12.8 Gb/s peak bandwidth)
    • Multi-port bus structure with independent FIFO to reduce design timing issues
  • Abundant logic resources with increased logic capacity
    • Optional shift register or distributed RAM support
    • Efficient 6-input LUTs improve performance and minimize power
    • LUT with dual flip-flops for pipeline centric applications
  • Block RAM with a wide range of granularity
    • Fast block RAM with byte write enable
    • 18 Kb blocks that can be optionally programmed as two independent 9 Kb block RAMs
  • Clock Management Tile (CMT) for enhanced performance
    • Low noise, flexible clocking
    • Digital Clock Managers (DCMs) eliminate clock skew and duty cycle distortion
    • Phase-Locked Loops (PLLs) for low-jitter clocking
    • Frequency synthesis with simultaneous multiplication, division, and phase shifting
    • Sixteen low-skew global clock networks
  • Simplified configuration, supports low-cost standards
    • 2-pin auto-detect configuration
    • Broad third-party SPI (up to x4) and NOR flash support
    • Feature rich Xilinx Platform Flash with JTAG
    • MultiBoot support for remote upgrade with multiple bitstreams, using watchdog protection
  • Enhanced security for design protection
    • Unique Device DNA identifier for design authentication
    • AES bitstream encryption in the larger devices
  • Faster embedded processing with enhanced, low cost, MicroBlaze™ soft processor
  • Industry-leading IP and reference designs

XC6SLX100-3FGG676C Prodotti

Parametri tecnici

  • Number of LABs/CLBs
  • 7911
  • Number of Logic Elements/Cells
  • 101261
  • Total RAM Bits
  • 4939776
  • Number of I/O
  • 480
  • Voltage Supply
  • 1.14V ~ 1.26V
  • Mounting Type
  • Surface Mount
  • Operating Temperature
  • 0??C ~ 85??C (TJ)
  • Package / Case
  • 676-BGA
  • Supplier Device Package
  • 676-FBGA (27x27)

XC6SLX100-3FGG676C Datasheet

  • XC6SLX100 Technical Support PDF Datasheet Overview

XC6SLX100-3FGG676C Parti Equivalenti

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Modelli Fabbricante Pacchetto Descrizione
XC6SLX100-3CSG484C XILINX BGA484 FPGA Spartan?-6 LX Family 101261 Cells 45nm (CMOS) Technology 1.2V 484Pin CSBGA
XC6SLX100-2FGG676C XILINX FBGA-676 FPGA Spartan-6 LX Family 101261 Cells 45nm (CMOS) Technology 1.2V 676Pin FBGA
XC6SLX100-1FGG676C

XC6SLX100-3FGG676C Related speciale

Ratings and Reviews (1)

  • 5 / 5
  • 5 Stars 100%
  • 4 Stars 0%
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  • 1 Stars 0%
  • **icol***
    2020-02-02

    First class many thanks , will buy from you again.

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Q: How does Jotrin guarantee that XC6SLX100-3FGG676C is the original manufacturer or agent of XILINX?
We have a professional business development department to strictly test and verify the qualifications of XILINX original manufacturers and agents. All XILINX suppliers must pass the qualification review before they can publish their XC6SLX100-3FGG676C devices; we pay more attention to the channels and quality of XC6SLX100-3FGG676C products than any other customer. We strictly implement supplier audits, so you can purchase with confidence.
Q: How to find the detailed information of XC6SLX100-3FGG676C chips? Including XILINX original factory information, FPGAs application, XC6SLX100-3FGG676C pictures?
You can use Jotrin's intelligent search engine, or filter by Spartan-6 FPGAs category, or find it through AMD Xilinx, Inc Information page.
Q: Are the XILINX's XC6SLX100-3FGG676C price and stock displayed on the platform accurate?
The XILINX's inventory fluctuates greatly and cannot be updated in time, it will be updated periodically within 24 hours. After submitting an order for XC6SLX100-3FGG676C, it is recommended to confirm the order with Jotrin salesperson or online customer service before payment.
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Q: What is the process for returns or replacement of XC6SLX100-3FGG676C?
All goods will implement Pre-Shipment Inspection (PSI), selected at random from all batches of your order to do a systematic inspection before arranging the shipment. If there is something wrong with the XC6SLX1003FGG676C we delivered, we will accept the replacement or return of the XC6SLX100-3FGG676C only when all of the below conditions are fulfilled:
(1)Such as a deficiency in quantity, delivery of wrong items, and apparent external defects (breakage and rust, etc.), and we acknowledge such problems.
(2)We are informed of the defect described above within 90 days after the delivery of XC6SLX100-3FGG676C.
(3)The XC6SLX100-3FGG676C is unused and only in the original unpacked packaging.
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AMD Xilinx, Inc

Xilinx
Xilinx is the inventor of the FPGA, CPLDs, programmable SoCs, and now, the ACAP, their highly-flexible programmable silicon, enabled by a suite of advanced software and tools, drives rapid innovation across a wide span of industries and technologies - from consumer to cars to the cloud....

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