Prodotti > Circuiti integrati (CI) > KLM8G2FE3B-B001

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  • Pacchetto :
  • FBGA-153
  • Tipologia di produzione :
  • Circuiti integrati (CI)
  • RoHs Status:
  • Lead free/RoHS Compliant
  • Stock:
  • 3000


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KLM8G2FE3B-B001 Dettagli del prodotto

Rev. 1.0, Oct. 2011 KLMxGxFE3B-x00x Samsung e·MMC Product family e.MMC 4.41 Specification compatibility datasheet SAMSUNG ELECTRONICS RESERVES THE RIGHT TO CHANGE PRODUCTS, INFORMATION AND SPECIFICATIONS WITHOUT NOTICE. Products and specifications discussed herein are for reference purposes only. All information discussed herein is provided on an “AS IS” basis, without warranties of any kind. This document and all information discussed herein remain the sole and exclusive property of Samsung Electronics. No license of any patent, copyright, mask work, trademark or any other intellectual property right is granted by one party to the other party under this document, by implication, estoppel or otherwise. Samsung products are not intended for use in life support, critical care, medical, safety equipment, or similar applications where product failure could result in loss of life or personal or physical harm, or any military or defense application, or any governmental procurement to which special terms or provisions may apply. For updates or additional information about Samsung products, contact your nearest Samsung office. All brand names, trademarks and registered trademarks belong to their respective owners. ⓒ 2011 Samsung Electronics Co., Ltd. All rights reserved. -1- KLMxGxFE3B-x00x datasheet Rev. 1.0 e·MMC Revision History Revision No. 0.0 0.1 0.5 1.0 History 1. Initial issue 1. User Density Ratio & Part No. of 4GB are changed in Chapter1.0 2. Package Dimension(11.5mm x 13mm x 1.0mm ) Typo is corrected. 3. Max. size of Boot Partition 1,2 and RPMB is changed in Table 28. 4. Typ. Standby Current of NAND is changed to 15uA per chip in Chapter 8.2 1. Engineering Sample 2. SEC_COUNT and MAX_ENH_SIZE_MULT are changed in Chapter 6.4 3. Max. Write Timeout is changed in Chapter 7.1 4. Wakeup Time from Sleep Mode is added in Chapter 5.1.6 5. Remarks of Init, Runtime bad block and remain reserved block per bank in Smart Report Output data are changed in Chapter 5.2.2 1. Typo of Product Name Table is changed in Chapter 6.2.1 2. Performance is updated with measured value in Chapter 5.2.3 3. Read Latency after High Priority Interrupt and Typ. Value of Time Parameter are deleted in Chapter 7.1 4. Wakeup Time from APS Mode and Sleep Mode is deleted in Table 26 5. User Density(%) of 4GB is modified in Chapter 1.0 Draft Date Jun. 01, 2011 Aug. 05, 2011 Sep. 01, 2011 Oct. 12, 2011 Remark Target Target Preliminary Final Editor S.M.Lee S.M.Lee S.M.Lee S.M.Lee -2- KLMxGxFE3B-x00x datasheet Revision History Appendix(0.1) Before(ver.0.0) After(ver.0.1) Rev. 1.0 e·MMC -3- KLMxGxFE3B-x00x datasheet Revision History Appendix(0.5) Before(ver.0.1) After(ver.0.5) Rev. 1.0 e·MMC -4- KLMxGxFE3B-x00x datasheet Revision History Appendix(1.0) Before(ver.0.5) After(ver.1.0) Rev. 1.0 e·MMC -5- KLMxGxFE3B-x00x datasheet Rev. 1.0 e·MMC Table Of Contents 1.0 PRODUCT LIST…………………………………………………………………. […]




The SAMSUNG e·MMC is an embedded MMC solution designed in a BGA package form. e·MMC operation is identical to a MMC card and therefore is a simple read and write to memory using MMC protocol v4.41 which is a industry standard.e·MMC consists of NAND flash and a MMC controller. 3V supply voltage is required for the NAND area (VDDF) whereas 1.8V or 3V dual supply voltage (VDD) is supported for the MMC controller. Maximum MMC interface frequency of 52MHz and maximum bus widths of 8 bit are supported.
There are several advantages of using e·MMC. It is easy to use as the MMC interface allows easy integration with any microprocessor with MMC host.Any revision or amendment of NAND is invisible to the host as the embedded MMC controller insulates NAND technology from the host. This leads to faster product development as well as faster times to market.
The embedded flash mangement software or FTL(Flash Transition Layer) of e·MMC manages Wear Leveling, Bad Block Management and ECC. The FTL supports all features of the Samsung NAND flash and achieves optimal performance.

MultiMediaCard System Specification Ver. 4.41 compatible. Detail description is referenced by JEDEC Standard
SAMSUNG e·MMC supports below special features which are being discussed in JEDEC
- High Priority Interrupt scheme is supported
- Back ground operation is supported.
 Full backward compatibility with previous MultiMediaCard system ( 1bit data bus, multi-e·MMC systems)
 Data bus width : 1bit (Default) , 4bit and 8bit
 MMC I/F Clock Frequency : 0 ~ 52MHz
MMC I/F Boot Frequency : 0 ~ 52MHz
 Temperature : Operation(-25C ~ 85C), Storage without operation (-40C ~ 85C)
 Power : Interface power → VDD (1.70V ~ 1.95V or 2.7V ~ 3.6V) , Memory power → VDDF(2.7V ~ 3.6V)

KLM8G2FE3B-B001 Prodotti

KLM8G2FE3B-B001 Pinout
(Immagine: Pinout)

KLM8G2FE3B-B001 Block Diagram
(Immagine: Diagram)

Parametri tecnici

  • Fabbricante
  • Imballaggio
  • Tape & Reel (TR)/Cut Tape (CT)/Tray/Tube
  • RoHs Status
  • Lead free/RoHS Compliant
  • Pacchetto
  • FBGA-153

KLM8G2FE3B-B001 Related speciale

Ratings and Reviews (2)

  • 5 / 5
  • 5 Stars 100%
  • 4 Stars 0%
  • 3 Stars 0%
  • 2 Stars 0%
  • 1 Stars 0%
  • **onch***

    пришел очень быстро.спасибо.

  • **ndre***

    Looks good. Not tested them yet.

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Estimated Delivery Time: Sep 27 - Oct 02 days (choose Expedited at checkout).

Spedizione & Pagamento


  • Tipo di spedizione
  • Tassa della nave
  • Lead Time
  • $20.00-$40.00 (0.50 KG)
  • 2-5 days
  • $20.00-$40.00 (0.50 KG)
  • 3-7 days
  • $20.00-$45.00 (0.50 KG)
  • 2-5 days
  • $25.00-$65.00 (0.50 KG)
  • 2-5 days
  • $25.00-$45.00 (0.50 KG)
  • 5-14 days
  • $2.00-$3.00 (0.10 KG)
  • 7-30 days

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  • Condizioni di pagamento
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  • charge US$0.00 banking fee.

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    Più basso tassa di spedizione internazionale parte da US $ 2,00.

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    90 giorni di garanzia di qualità per tutti i prodotti.


  • Step1:Product

    Step1: Products

  • Step2:Vacuum packaging

    Step2: Vacuum Packaging

  • Step3:Anti-static bag

    Step3: Anti-Static Bag

  • Step4:Individual packaging

    Step4: Individual Packaging

  • Step5:Packaging boxes

    Step5: Packaging Boxes

  • Step6:bar-code shipping tag

    Step6: Bar-Code Shipping Tag

All the products will packing in anti-staticbag. Ship with ESD antistatic protection.

Outside ESD packing’s lable will use ourcompany’s information: Part Mumber, Brand and Quantity.

We will inspect all the goods before shipment,ensure all the products at good condition and ensure the parts are new originalmatch datasheet.

After all the goods are ensure no problems afterpacking, we will packing safely and send by global express. It exhibitsexcellent puncture and tear resistance along with good seal integrity.

Jotrin ESD packing


1.We provide 90 days warranty.

2.If some of the items you received aren't of perfect quality, we would resiponsibly arrange your refund or replacement. But the items must remain their orginal condition.


Q: How does Jotrin guarantee that KLM8G2FE3B-B001 is the original manufacturer or agent of SAMSUNG?
We have a professional business development department to strictly test and verify the qualifications of SAMSUNG original manufacturers and agents. All SAMSUNG suppliers must pass the qualification review before they can publish their KLM8G2FE3B-B001 devices; we pay more attention to the channels and quality of KLM8G2FE3B-B001 products than any other customer. We strictly implement supplier audits, so you can purchase with confidence.
Q: How to find the detailed information of KLM8G2FE3B-B001 chips? Including SAMSUNG original factory information, application, KLM8G2FE3B-B001 pictures?
You can use Jotrin's intelligent search engine, or filter by Circuiti integrati (CI) category, or find it through Samsung Semiconductor, Inc Information page.
Q: Are the SAMSUNG's KLM8G2FE3B-B001 price and stock displayed on the platform accurate?
The SAMSUNG's inventory fluctuates greatly and cannot be updated in time, it will be updated periodically within 24 hours. After submitting an order for KLM8G2FE3B-B001, it is recommended to confirm the order with Jotrin salesperson or online customer service before payment.
Q: Can I place an order offline?
Yes. We accept offline orders.
We can provide order placement service. You only need to log in, click "My Orders" to enter the transaction management, and you will see the "Order Details" interface. After checking it, select all and click "Place Order". In addition, you can enjoy coupons or other selected gifts when placing orders online.
Q: What forms of payment can I use in Jotrin?
TT Bank, Paypal, Credit Card, Western Union, and Escrow is all acceptable.
Q: How is the shipping arranged and track my package?
Customers can choose industry-leading freight companies, including DHL, FedEx, UPS, TNT, and Registered Mail.
Once your order has been processed for shipment, our sales will send you an e-mail advising you of the shipping status and tracking number.
Note: It may take up to 24 hours before carriers will display tracking information. In normal conditions, Express delivery needs 3-5 days, Registered Mail needs 25-60 days.
Q: What is the process for returns or replacement of KLM8G2FE3B-B001?
All goods will implement Pre-Shipment Inspection (PSI), selected at random from all batches of your order to do a systematic inspection before arranging the shipment. If there is something wrong with the KLM8G2FE3BB001 we delivered, we will accept the replacement or return of the KLM8G2FE3B-B001 only when all of the below conditions are fulfilled:
(1)Such as a deficiency in quantity, delivery of wrong items, and apparent external defects (breakage and rust, etc.), and we acknowledge such problems.
(2)We are informed of the defect described above within 90 days after the delivery of KLM8G2FE3B-B001.
(3)The KLM8G2FE3B-B001 is unused and only in the original unpacked packaging.
Two processes to return the products:
(1)Inform us within 90 days
(2)Obtain Requesting Return Authorizations
More details about return electronic components please see our Return & Change Policy.
Q: How to contact us and get support, such as KLM8G2FE3B-B001 datasheet pdf, KLM8G2FE3B pin diagram?
Need any After-Sales service, please feel free contact us:

Samsung Semiconductor, Inc

Samsung achieved and has held market leadership in DRAM and SRAM since the early 1990s, and in NAND Flash since 2003. In 2001, Samsung also signalled its long commitment to logic and analog chip development with the expansion of the System LSI Division and the opening of the SoC Research Lab....

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