TSSOP31

Q:What defines the physical structure of TSSOP31?

A:Key features include:
- Leadless bottom-mounted pads: Ensures stable PCB attachment.
- Central thermal pad: ~60% coverage for improved heat dissipation.
- 31-pin layout: Dual-row gull-wing leads for compact routing.
- Ultra-thin profile: 1.0 mm thickness for space-constrained designs.

Q:Why choose TSSOP31 over alternatives?

A:Critical advantages:
- Miniaturization: 30% smaller footprint than SOIC equivalents.
- Thermal Performance: Direct PCB heat path via exposed thermal pad.
- Electrical Benefits: Low-inductance (<1 nH) leadframe design.
- Reliability: Moisture-resistant (MSL3-rated) substrate.

Q:What are common technical specs?

A:Standard configurations (consult datasheets):
- Body Size: 7.8 × 4.4 mm
- Height: 1.0 mm
- Pin Pitch: 0.5 mm
- Material: Copper-alloy leads with matte Sn plating.
- Temp Range: -40°C to +125°C (industrial grade).

Q:Where is TSSOP31 typically applied?

A:Dominant use cases:
- Power Management: DC-DC converters (e.g., TI TPS62130).
- RF Modules: Bluetooth/Wi-Fi transceivers (e.g., NRF52840).
- Sensor Interfaces: MEMS accelerometers (e.g., ADXL345).

Q:What are critical assembly guidelines?

A:Key recommendations:
- PCB Design: 4×4 thermal via array under central pad (0.3 mm diameter).
- Solder Paste: Type 4 (5–15 µm particle size) for fine-pitch printing.
- Reflow Profile: Peak temp ≤ 250°C (Pb-free process).
- Inspection: X-ray (AXI) mandatory for void detection (<15% acceptable).