SOT-343-4
- Immagine & Modelli
- Descrizione
- Unire Prezzo
- Quantità
- Operazione
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PHEMT Low Noise Amplifier with Bypass Switch,RF Amplifier 2.7-4.2 SV 14 dB
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1 + 10 + 25 + 50 + >=100 -
Minimo : 1 Stock : 9981
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PHEMT Low Noise Amplifier with Bypass Switch,RF Amplifier 2.7-4.2 SV 14 dB
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1 + 10 + 25 + 50 + >=100 -
Minimo : 1 Stock : 1200
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RF Amplifier IC, 16 dB Gain / 1.1 dB Noise, 100 MHz to 6 GHz, 2.7 V to 4.2 V supply, SOT-343-4
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1 + 10 + 25 + 50 + >=100 -
Minimo : 1 Stock : 1558
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RF Amplifier, N Channel, 17.4 dB Gain / 1.9 dB Noise, 50 MHz to 6 GHz, 5 V Supply, SOT-343-4
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1 + 10 + 25 + 50 + >=100 -
Minimo : 1 Stock : 1480
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RF Amplifier IC, 24.5 dB Gain / 1.9 dB Noise, 100 MHz to 2.5 GHz, 2.7 V to 5 V supply, SOT-343-4
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1 + 10 + 25 + 50 + >=100 -
Minimo : 1 Stock : 65
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Power Switch ICs - Power Distribution HITFET SMART SIDE
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1 + 10 + 25 + 50 + >=100 -
Minimo : 1 Stock : 7620
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Smart High-Side Power Switch One Channel: 1 x 1з,Power Switch ICs - Power Distribution Smart High Side MINI-PROFET
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1 + 10 + 25 + 50 + >=100 -
Minimo : 1 Stock : 33605
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RF Amp Chip Single GP 6GHz 2.8V 4-Pin(3+Tab) SOT-343
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1 + 10 + 25 + 50 + >=100 -
Minimo : 1 Stock : 2934
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Transistors RF Bipolar Small Signal NPN Silicon RF TRANSISTOR
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1 + 10 + 25 + 50 + >=100 -
Minimo : 1 Stock : 20
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N-channel dual-gate MOS-FETs,MOSFET TAPE-7 MOS-RFSS
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1 + 10 + 25 + 50 + >=100 -
Minimo : 1 Stock : 480000
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LED driver IC, Active Bias Controller, 1.8 V to 18 V supply, SOT-343-4
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1 + 10 + 25 + 50 + >=100 -
Minimo : 1 Stock : 100
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Diodes - General Purpose, Power, Switching AF DIGITAL TRANSISTOR
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1 + 10 + 25 + 50 + >=100 -
Minimo : 1 Stock : 50
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Diodes (General Purpose, Power, Switching) Silicon Switching Diode 200mA
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1 + 10 + 25 + 50 + >=100 -
Minimo : 1 Stock : 3600
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Silicon Bipolar Darlington Amplifier,RF Amplifier DC - 2.5 GHz 16.5dB
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1 + 10 + 25 + 50 + >=100 -
Minimo : 1 Stock : 20019
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Silicon Bipolar Darlington Amplifier,RF Amplifier DC - 2.5 GHz 17 dB
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1 + 10 + 25 + 50 + >=100 -
Minimo : 1 Stock : 8050
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Q:What defines the physical structure of SOT-343-4?
A:Key features include:
- Leadless bottom-mounted pads: Ensures stable PCB attachment.
- Central thermal pad: Improves heat dissipation (covers ~60% of the base area).
- 4-pin layout with dual-side alignment: Optimizes space efficiency.
- 1.0 mm ultra-thin profile: Ideal for low-profile designs. -
Q:Why choose SOT-343-4 over alternatives?
A:Critical advantages:
- Miniaturization: 30% smaller than SOT-23, saving PCB space.
- Thermal Performance: Direct PCB heat path reduces junction temperature by ~15%.
- Electrical Benefits: Low-inductance design (<1 nH) for high-frequency stability.
- Reliability: Moisture-resistant (MSL3-rated) substrate for harsh environments. -
Q:What are common technical specs?
A:Standard configurations (consult datasheets):
- Body Size: 2.0 × 1.25 mm
- Height: 1.0 mm
- Pin Pitch: 0.65 mm
- Material: Copper-alloy leads with matte-tin plating.
- Temp Range: -40°C to +150°C. -
Q:Where is SOT-343-4 typically applied?
A:Dominant use cases:
- Power Management: DC-DC converters (e.g., TPS62090).
- RF Modules: Low-noise amplifiers (e.g., BGA2818).
- Sensor Interfaces: IoT devices (e.g., BME280 environmental sensors). -
Q:What are critical assembly guidelines?
A:Key recommendations:
- PCB Design: Use thermal vias under the pad for optimal heat transfer.
- Solder Paste: Type 4 solder (particle size 20–38 μm) recommended.
- Reflow Profile: Peak temperature ≤ 250°C (Pb-free process).
- Inspection: X-ray (AXI) mandatory due to hidden solder joints.



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