BGA-200

Q:What defines the physical structure of BGA-200?

A:Key features include:
- Leadless bottom-mounted pads: Ensures robust PCB attachment.
- Central thermal pad (10×10 mm coverage): Enhances heat dissipation.
- 200-pin layout with perimeter array: Optimizes I/O density.
- 1.2 mm ultra-thin profile: Saves vertical space in compact designs.

Q:Why choose BGA-200 over alternatives?

A:Critical advantages:
- Miniaturization: 30% smaller footprint than equivalent QFP packages.
- Thermal Performance: Direct PCB heat path via thermal pad reduces junction temperature by 15%.
- Electrical Benefits: Low-inductance design (<0.5 nH) for high-speed signals.
- Reliability: Moisture-resistant substrate (MSL-3 rated).

Q:What are common technical specs?

A:Standard configurations (consult datasheets):
- Body Size: 15×15 mm
- Height: 1.2 mm
- Pin Pitch: 0.8 mm
- Material: Copper-alloy solder balls
- Temp Range: -40°C to +125°C

Q:Where is BGA-200 typically applied?

A:Dominant use cases:
- Networking: High-speed switches (e.g., Broadcom BCMxxxx series).
- Automotive: ECU modules (e.g., NXP S32G processors).
- Consumer Electronics: Miniaturized IoT devices (e.g., Qualcomm QCS4xx SoCs).

Q:What are critical assembly guidelines?

A:Key recommendations:
- PCB Design: 4×4 thermal vias under pad (0.3 mm diameter).
- Solder Paste: Type 4 solder recommended for fine-pitch reliability.
- Reflow Profile: Peak temp ≤ 245°C (Pb-free process).
- Inspection: X-ray (AXI) mandatory for void detection.