BGA63

Q:What defines the physical structure of BGA63?

A:Key features include:
- Leadless bottom-mounted pads: Ensures direct PCB connectivity without protruding leads.
- Central thermal pad (80% coverage): Enhances heat dissipation for high-power applications.
- 63-pin layout with 7×9 grid arrangement: Optimizes pin density and signal routing.
- 1.2 mm ultra-thin profile: Ideal for space-constrained designs.

Q:Why choose BGA63 over alternatives?

A:Critical advantages:
- Miniaturization: 40% smaller than equivalent QFP packages.
- Thermal Performance: Direct PCB heat path via central pad reduces junction temperature by 15°C.
- Electrical Benefits: Low-inductance design (<0.5 nH) for high-frequency signals.
- Reliability: Moisture-resistant substrate (MSL3 certified) for harsh environments.

Q:What are common technical specs for BGA63?

A:Standard configurations (consult datasheets):
- Body Size: 8.0 × 8.0 mm
- Height: 1.2 mm
- Pin Pitch: 0.8 mm
- Material: Copper-alloy pads with Sn-Ag-Cu solder balls
- Temp Range: -40°C to +125°C (industrial grade)

Q:Where is BGA63 typically applied?

A:Dominant use cases:
- Power Converters: e.g., Buck/boost ICs (e.g., TPS62130).
- RF Modules: e.g., Bluetooth/Wi-Fi SoCs (e.g., CC2652R).
- Sensor Interfaces: e.g., MEMS accelerometers (e.g., LSM6DSO).

Q:What are critical assembly guidelines for BGA63?

A:Key recommendations:
- PCB Design: 4×4 thermal vias array under the central pad (0.3 mm diameter).
- Solder Paste: Type 4 solder (5–15 µm particle size) for fine-pitch printing.
- Reflow Profile: Peak temp ≤ 245°C (Pb-free process, 60 sec above 217°C).
- Inspection: X-ray (AXI) mandatory for void detection (<25% acceptable).