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900-BBGA, FCBGA
900-BBGA, FCBGA
The 900-BBGA, FCBGA (Flip Chip Ball Grid Array) is a surface-mount package designed for high-density integrated circuits. Featuring flip-chip interconnection, a high-density solder ball array, and an exposed thermal pad, it delivers superior electrical performance, excellent heat dissipation, and space-efficient design. Typical dimensions are 31×31 mm with a 1.0 mm ball pitch and 2.7 mm height, making it ideal for high-performance computing, networking equipment, and telecommunications infrastructure. Its bottom-exposed die pad enables direct PCB thermal transfer, while RoHS-compliant substrates ensure reliability in industrial environments.
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IC SOC CORTEX-A53 900FCBGA
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1 + 10 + 25 + 50 + >=100 -
Minimo : 1 Stock : 8548
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Zynq UltraScale+ MPSoC: EG Device SOC CORTEX-A53 900FCBGA
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1 + 10 + 25 + 50 + >=100 -
Minimo : 1 Stock : 3
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Zynq UltraScale+ MPSoC: EG Device SOC CORTEX-A53 900FCBGA
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1 + 10 + 25 + 50 + >=100 -
Minimo : 1 Stock : 813
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Zynq UltraScale+ MPSoC: EG Device SOC CORTEX-A53 900FCBGA
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1 + 10 + 25 + 50 + >=100 -
Minimo : 1 Stock : 815
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Zynq UltraScale+ MPSoC: EG Device SOC CORTEX-A53 900FCBGA
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1 + 10 + 25 + 50 + >=100 -
Minimo : 1 Stock : 38
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Zynq UltraScale+ MPSoC: EG Device SOC CORTEX-A53 900FCBGA
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1 + 10 + 25 + 50 + >=100 -
Minimo : 1 Stock : 969
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Zynq UltraScale+ MPSoC: EG Device SOC CORTEX-A53 900FCBGA
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1 + 10 + 25 + 50 + >=100 -
Minimo : 1 Stock : 465
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Zynq UltraScale+ MPSoC: EG Device SOC CORTEX-A53 900FCBGA
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1 + 10 + 25 + 50 + >=100 -
Minimo : 1 Stock : 793
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Zynq UltraScale+ MPSoC: CG Device SOC CORTEX-A53 900FCBGA
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1 + 10 + 25 + 50 + >=100 -
Minimo : 1 Stock : 883
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Zynq UltraScale+ MPSoC: CG Device SOC CORTEX-A53 900FCBGA
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1 + 10 + 25 + 50 + >=100 -
Minimo : 1 Stock : 641
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Zynq UltraScale+ MPSoC: CG Device SOC CORTEX-A53 900FCBGA
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1 + 10 + 25 + 50 + >=100 -
Minimo : 1 Stock : 111
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Zynq UltraScale+ MPSoC: CG Device SOC CORTEX-A53 900FCBGA
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1 + 10 + 25 + 50 + >=100 -
Minimo : 1 Stock : 258
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Zynq UltraScale+ MPSoC: CG Device SOC CORTEX-A53 900FCBGA
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1 + 10 + 25 + 50 + >=100 -
Minimo : 1 Stock : 970
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Zynq UltraScale+ MPSoC: CG Device SOC CORTEX-A53 900FCBGA
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1 + 10 + 25 + 50 + >=100 -
Minimo : 1 Stock : 453
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Microprocessor PSoC/MPSoC, Zynq Family UltraScale+ ARM Cortex-A53, ARM Cortex-R5, 1.5GHz, FCBGA-900
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1 + 10 + 25 + 50 + >=100 -
Minimo : 1 Stock : 820
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Microprocessor PSoC/MPSoC, Zynq Family UltraScale+ ARM Cortex-A53, ARM Cortex-R5, 1.5GHz, FCBGA-900
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1 + 10 + 25 + 50 + >=100 -
Minimo : 1 Stock : 771
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Zynq UltraScale+ MPSoC: EV Device SOC CORTEX-A53 900FCBGA
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1 + 10 + 25 + 50 + >=100 -
Minimo : 1 Stock : 588
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Microprocessor PSoC/MPSoC, Zynq Family UltraScale+ ARM Cortex-A53, ARM Cortex-R5, 1.5GHz, FCBGA-900
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1 + 10 + 25 + 50 + >=100 -
Minimo : 1 Stock : 493
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Microprocessor PSoC/MPSoC, Zynq Family UltraScale+ ARM Cortex-A53, ARM Cortex-R5, 1.5GHz, FCBGA-900
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1 + 10 + 25 + 50 + >=100 -
Minimo : 1 Stock : 695
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Microprocessor PSoC/MPSoC, Zynq Family UltraScale+ ARM Cortex-A53, ARM Cortex-R5, 1.5GHz, FCBGA-900
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1 + 10 + 25 + 50 + >=100 -
Minimo : 1 Stock : 100
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Microprocessor PSoC/MPSoC, Zynq Family UltraScale+ ARM Cortex-A53, ARM Cortex-R5, 1.5GHz, FCBGA-900
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1 + 10 + 25 + 50 + >=100 -
Minimo : 1 Stock : 145
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Zynq UltraScale+ MPSoC: EG Device SOC CORTEX-A53 900FCBGA
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1 + 10 + 25 + 50 + >=100 -
Minimo : 1 Stock : 99
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Zynq UltraScale+ MPSoC: EG Device SOC CORTEX-A53 900FCBGA
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1 + 10 + 25 + 50 + >=100 -
Minimo : 1 Stock : 688
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Zynq UltraScale+ MPSoC: EG Device SOC CORTEX-A53 900FCBGA
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1 + 10 + 25 + 50 + >=100 -
Minimo : 1 Stock : 968
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Zynq UltraScale+ MPSoC: EG Device SOC CORTEX-A53 900FCBGA
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1 + 10 + 25 + 50 + >=100 -
Minimo : 1 Stock : 450
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Zynq UltraScale+ MPSoC: EG Device SOC CORTEX-A53 900FCBGA
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1 + 10 + 25 + 50 + >=100 -
Minimo : 1 Stock : 636
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Zynq UltraScale+ MPSoC: EG Device SOC CORTEX-A53 900FCBGA
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1 + 10 + 25 + 50 + >=100 -
Stock : 1
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Zynq UltraScale+ MPSoC: CG Device SOC CORTEX-A53 900FCBGA
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1 + 10 + 25 + 50 + >=100 -
Minimo : 1 Stock : 295
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Zynq UltraScale+ MPSoC: CG Device SOC CORTEX-A53 900FCBGA
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1 + 10 + 25 + 50 + >=100 -
Minimo : 1 Stock : 182
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Zynq UltraScale+ MPSoC: CG Device SOC CORTEX-A53 900FCBGA
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1 + 10 + 25 + 50 + >=100 -
Minimo : 1 Stock : 38
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Zynq UltraScale+ MPSoC: CG Device SOC CORTEX-A53 900FCBGA
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1 + 10 + 25 + 50 + >=100 -
Minimo : 1 Stock : 457
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Zynq UltraScale+ MPSoC: CG Device SOC CORTEX-A53 900FCBGA
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1 + 10 + 25 + 50 + >=100 -
Minimo : 1 Stock : 502
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Zynq UltraScale+ MPSoC: CG Device SOC CORTEX-A53 900FCBGA
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1 + 10 + 25 + 50 + >=100 -
Minimo : 1 Stock : 526
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Zynq UltraScale+ MPSoC: EG Device SOC CORTEX-A53 900FCBGA
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1 + 10 + 25 + 50 + >=100 -
Minimo : 1 Stock : 146
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Zynq UltraScale+ MPSoC: EG Device SOC CORTEX-A53 900FCBGA
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1 + 10 + 25 + 50 + >=100 -
Minimo : 1 Stock : 212
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Zynq UltraScale+ MPSoC: EG Device SOC CORTEX-A53 900FCBGA
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1 + 10 + 25 + 50 + >=100 -
Minimo : 1 Stock : 814
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Zynq UltraScale+ MPSoC: EG Device SOC CORTEX-A53 900FCBGA
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1 + 10 + 25 + 50 + >=100 -
Minimo : 1 Stock : 75
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Zynq UltraScale+ MPSoC: EG Device SOC CORTEX-A53 900FCBGA
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1 + 10 + 25 + 50 + >=100 -
Minimo : 1 Stock : 91
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Zynq UltraScale+ MPSoC: CG Device SOC CORTEX-A53 900FCBGA
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1 + 10 + 25 + 50 + >=100 -
Minimo : 1 Stock : 314
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Zynq UltraScale+ MPSoC: CG Device SOC CORTEX-A53 900FCBGA
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1 + 10 + 25 + 50 + >=100 -
Minimo : 1 Stock : 944
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Zynq UltraScale+ MPSoC: CG Device SOC CORTEX-A53 900FCBGA
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1 + 10 + 25 + 50 + >=100 -
Minimo : 1 Stock : 263
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Zynq UltraScale+ MPSoC: CG Device SOC CORTEX-A53 900FCBGA
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1 + 10 + 25 + 50 + >=100 -
Minimo : 1 Stock : 134
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Zynq UltraScale+ MPSoC: CG Device SOC CORTEX-A53 900FCBGA
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1 + 10 + 25 + 50 + >=100 -
Minimo : 1 Stock : 725
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Zynq UltraScale+ MPSoC: CG Device SOC CORTEX-A53 900FCBGA
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1 + 10 + 25 + 50 + >=100 -
Minimo : 1 Stock : 33
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Zynq UltraScale+ MPSoC: EV Device SOC CORTEX-A53 900FCBGA
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1 + 10 + 25 + 50 + >=100 -
Minimo : 1 Stock : 933
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Zynq UltraScale+ MPSoC: EV Device SOC CORTEX-A53 900FCBGA
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1 + 10 + 25 + 50 + >=100 -
Minimo : 1 Stock : 950
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Zynq UltraScale+ MPSoC: EV Device SOC CORTEX-A53 900FCBGA
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1 + 10 + 25 + 50 + >=100 -
Minimo : 1 Stock : 283
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Zynq UltraScale+ MPSoC: EV Device SOC CORTEX-A53 900FCBGA
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1 + 10 + 25 + 50 + >=100 -
Minimo : 1 Stock : 131
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Zynq UltraScale+ MPSoC: EV Device SOC CORTEX-A53 900FCBGA
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1 + 10 + 25 + 50 + >=100 -
Minimo : 1 Stock : 339
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Zynq UltraScale+ MPSoC: EV Device SOC CORTEX-A53 900FCBGA
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1 + 10 + 25 + 50 + >=100 -
Minimo : 1 Stock : 326
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Q:What defines the physical structure of 900-BBGA, FCBGA?
A:Key features include:
- Leadless bottom-mounted pads: Ensures reliable solder connections.
- Central thermal pad: 80% coverage for enhanced heat dissipation.
- 900-pin layout: Staggered arrangement for high-density interconnects.
- Ultra-thin profile: 1.2 mm thickness for space-constrained designs. -
Q:Why choose 900-BBGA, FCBGA over alternatives?
A:Critical advantages:
- Miniaturization: 40% smaller footprint than traditional BGA packages.
- Thermal Performance: Direct PCB heat path reduces junction temperature by 25%.
- Electrical Benefits: Low-inductance design (<0.5 nH) for high-speed signals.
- Reliability: Moisture-resistant substrate (MSL3 rating) for harsh environments. -
Q:What are common technical specs?
A:Standard configurations (consult datasheets):
- Body Size: 31 × 31 mm.
- Height: 1.2 mm.
- Pin Pitch: 0.8 mm.
- Material: Copper-alloy leads with solder mask.
- Temp Range: -40°C to +125°C (industrial grade). -
Q:Where is 900-BBGA, FCBGA typically applied?
A:Dominant use cases:
- High-performance computing: GPUs/CPUs (e.g., NVIDIA H100).
- Telecom infrastructure: 5G RF modules (e.g., Qualcomm X65).
- Automotive ECUs: Sensor fusion units (e.g., Tesla FSD). -
Q:What are critical assembly guidelines?
A:Key recommendations:
- PCB Design: 4×4 thermal via array under the central pad.
- Solder Paste: Type 4 (5–15 µm particle size) recommended.
- Reflow Profile: Peak temp ≤ 245°C (Pb-free process).
- Inspection: X-ray (AXI) mandatory for void detection (<10%).