1156-BBGA, FCBGA
- Immagine & Modelli
- Descrizione
- Unire Prezzo
- Quantità
- Operazione
-
-
48-lane, 12-port PCIe I/O Connectivity Switch; HT SUSA CODE:8542390000
-
1 + 10 + 25 + 50 + >=100 -
Minimo : 1 Stock : 504
-
-
48-lane, 12-port PCIe I/O Connectivity Switch; HT SUSA CODE:8542390000
-
1 + 10 + 25 + 50 + >=100 -
Minimo : 1 Stock : 108
-
-
IC PCI SW 48LANE 12PORT 1156BGA; HT SUSA CODE:8542390000
-
1 + 10 + 25 + 50 + >=100 -
Minimo : 1 Stock : 734
-
-
IC PCI SW 16LANE 16PORT 1156BGA; HT SUSA CODE:8542390000
-
1 + 10 + 25 + 50 + >=100 -
Minimo : 1 Stock : 924
-
-
64-lane, 16-port PCIe Gen2 System Interconnect Switch; HT SUSA CODE:8542390000
-
1 + 10 + 25 + 50 + >=100 -
Minimo : 1 Stock : 513
-
-
PCI Express Switch System Interconnect Switch 64Lanes 16Ports 1CH 1156Pin FCBGA Tray
-
1 + 10 + 25 + 50 + >=100 -
Minimo : 1 Stock : 105
-
-
PCI Express Switch System Interconnect Switch 64Lanes 16Ports 1CH 1156Pin FCBGA Tray
-
1 + 10 + 25 + 50 + >=100 -
Minimo : 1 Stock : 303
-
-
IC PCI SW 48LANE 12Port 676BGA; HT SUSA CODE:8542390000
-
1 + 10 + 25 + 50 + >=100 -
Minimo : 1 Stock : 952
-
-
PCI Express Switch System Interconnect Switch 48Lanes 12Ports 1156Pin FCBGA Tray
-
1 + 10 + 25 + 50 + >=100 -
Minimo : 1 Stock : 671
-
-
PCI Express Switch System Interconnect Switch 48Lanes 12Ports 1156Pin FCBGA Tray
-
1 + 10 + 25 + 50 + >=100 -
Minimo : 1 Stock : 84
-
-
PCI Express Switch System Interconnect Switch 32Lanes 16Ports 1156Pin FCBGA Tray
-
1 + 10 + 25 + 50 + >=100 -
Minimo : 1 Stock : 908
-
-
48-lane, 12-port PCIe I/O Connectivity Switch; HT SUSA CODE:8542390000
-
1 + 10 + 25 + 50 + >=100 -
Minimo : 1 Stock : 333
-
-
IC PCI SW 48LANE 12PORT 1156BGA; HT SUSA CODE:8542390000
-
1 + 10 + 25 + 50 + >=100 -
Minimo : 1 Stock : 872
-
-
48-Lane 12Port PCI Express System Interconnect Switch Surface Mount 1156Pin FC-BGA
-
1 + 10 + 25 + 50 + >=100 -
Minimo : 1 Stock : 642
-
-
48-Lane 12Port PCI Express System Interconnect Switch Surface Mount 1156Pin FC-BGA
-
1 + 10 + 25 + 50 + >=100 -
Minimo : 1 Stock : 662
-
-
34-Lane 16Port PCI Express Switch Surface Mount 1156Pin FC-BGA
-
1 + 10 + 25 + 50 + >=100 -
Minimo : 1 Stock : 59
-
-
PCI Express Switch System Interconnect Switch 64Lanes 16Ports 1156Pin FCBGA Tray
-
1 + 10 + 25 + 50 + >=100 -
Minimo : 1 Stock : 302
-
-
PCI Express Switch System Interconnect Switch 64Lanes 16Ports 1CH 1156Pin FCBGA Tray
-
1 + 10 + 25 + 50 + >=100 -
Minimo : 1 Stock : 58
-
-
PCI Express Switch System Interconnect Switch 48Lanes 12Ports 1156Pin FCBGA Tray
-
1 + 10 + 25 + 50 + >=100 -
Minimo : 1 Stock : 566
-
-
PCI Express Switch System Interconnect Switch 32Lanes 16Ports 1156Pin FCBGA Tray
-
1 + 10 + 25 + 50 + >=100 -
Minimo : 1 Stock : 995
-
-
Zynq UltraScale+ MPSoC: EG Device SOC CORTEX-A53 1156FCBGA
-
1 + 10 + 25 + 50 + >=100 -
Minimo : 1 Stock : 829
-
-
Zynq UltraScale+ MPSoC: EG Device SOC CORTEX-A53 1156FCBGA
-
1 + 10 + 25 + 50 + >=100 -
Minimo : 1 Stock : 294
-
-
Zynq UltraScale+ MPSoC: EG Device SOC CORTEX-A53 1156FCBGA
-
1 + 10 + 25 + 50 + >=100 -
Minimo : 1 Stock : 854
-
-
Microprocessor Zynq Family UltraScale+ Series FPGAs, ARM Cortex-A53, 1.5GHz, FCBGA-1156
-
1 + 10 + 25 + 50 + >=100 -
Minimo : 1 Stock : 53
-
-
Zynq UltraScale+ MPSoC: EG Device SOC CORTEX-A53 1156FCBGA
-
1 + 10 + 25 + 50 + >=100 -
Minimo : 1 Stock : 186
-
-
Zynq UltraScale+ MPSoC: EG Device SOC CORTEX-A53 1156FCBGA
-
1 + 10 + 25 + 50 + >=100 -
Minimo : 1 Stock : 514
-
-
Zynq UltraScale+ MPSoC: EG Device SOC CORTEX-A53 1156FCBGA
-
1 + 10 + 25 + 50 + >=100 -
Minimo : 1 Stock : 554
-
-
Zynq UltraScale+ MPSoC: CG Device SOC CORTEX-A53 1156FCBGA
-
1 + 10 + 25 + 50 + >=100 -
Minimo : 1 Stock : 352
-
-
Zynq UltraScale+ MPSoC: CG Device SOC CORTEX-A53 1156FCBGA
-
1 + 10 + 25 + 50 + >=100 -
Minimo : 1 Stock : 274
-
-
Zynq UltraScale+ MPSoC: CG Device SOC CORTEX-A53 1156FCBGA
-
1 + 10 + 25 + 50 + >=100 -
Minimo : 1 Stock : 100
-
-
Zynq UltraScale+ MPSoC: CG Device SOC CORTEX-A53 1156FCBGA
-
1 + 10 + 25 + 50 + >=100 -
Minimo : 1 Stock : 785
-
-
Zynq UltraScale+ MPSoC: CG Device SOC CORTEX-A53 1156FCBGA
-
1 + 10 + 25 + 50 + >=100 -
Minimo : 1 Stock : 599
-
-
Zynq UltraScale+ MPSoC: CG Device SOC CORTEX-A53 1156FCBGA
-
1 + 10 + 25 + 50 + >=100 -
Minimo : 1 Stock : 420
-
-
Microprocessor PSoC/MPSoC, Zynq Family UltraScale+ ARM Cortex-A53, ARM Cortex-R5, 1.5GHz, FCBGA-1156
-
1 + 10 + 25 + 50 + >=100 -
Minimo : 1 Stock : 829
-
-
Microprocessor PSoC/MPSoC, Zynq Family UltraScale+ ARM Cortex-A53, ARM Cortex-R5, 1.5GHz, FCBGA-1156
-
1 + 10 + 25 + 50 + >=100 -
Minimo : 1 Stock : 890
-
-
Microprocessor PSoC/MPSoC, Zynq Family UltraScale+ ARM Cortex-A53, ARM Cortex-R5, 1.5GHz, FCBGA-1156
-
1 + 10 + 25 + 50 + >=100 -
Minimo : 1 Stock : 450
-
-
Microprocessor PSoC/MPSoC, Zynq Family UltraScale+ ARM Cortex-A53, ARM Cortex-R5, 1.5GHz, FCBGA-1156
-
1 + 10 + 25 + 50 + >=100 -
Minimo : 1 Stock : 300
-
-
Microprocessor PSoC/MPSoC, Zynq Family UltraScale+ ARM Cortex-A53, ARM Cortex-R5, 1.5GHz, FCBGA-1156
-
1 + 10 + 25 + 50 + >=100 -
Minimo : 1 Stock : 801
-
-
Microprocessor PSoC/MPSoC, Zynq Family UltraScale+ ARM Cortex-A53, ARM Cortex-R5, 1.5GHz, FCBGA-1156
-
1 + 10 + 25 + 50 + >=100 -
Minimo : 1 Stock : 420
-
-
Zynq UltraScale+ MPSoC: EG Device SOC CORTEX-A53 1156FCBGA
-
1 + 10 + 25 + 50 + >=100 -
Minimo : 1 Stock : 548
-
Q:What defines the physical structure of 1156-BBGA, FCBGA?
A:Key features include:
- Leadless bottom-mounted pads: Ensures robust PCB attachment.
- Central thermal pad: 10×10 mm coverage (80% area) for enhanced heat dissipation.
- 1156-pin layout: Staggered ball grid array (BGA) arrangement.
- Ultra-thin profile: 1.2 mm package height for space-constrained designs. -
Q:Why choose 1156-BBGA, FCBGA over alternatives?
A:Critical advantages:
- Miniaturization: 30% smaller footprint than 1156-LGA.
- Thermal Performance: Direct PCB heat path via thermal vias (5×5 array).
- Electrical Benefits: Low-inductance (<0.5 nH) design for high-speed signals.
- Reliability: Moisture-resistant substrate (MSL3 certified). -
Q:What are common technical specs?
A:Standard configurations (consult datasheets):
- Body Size: 35×35 mm.
- Height: 1.2 mm (max).
- Pin Pitch: 0.8 mm.
- Material: Copper-alloy balls with SnAgCu solder.
- Temp Range: -40°C to +125°C (industrial grade). -
Q:Where is 1156-BBGA, FCBGA typically applied?
A:Dominant use cases:
- High-performance computing: GPU/CPU power delivery (e.g., NVIDIA H100).
- Telecom infrastructure: 5G RF front-end modules (e.g., Qualcomm QPM56xx).
- Automotive ADAS: Sensor fusion controllers (e.g., NXP S32G). -
Q:What are critical assembly guidelines?
A:Key recommendations:
- PCB Design: 4×4 thermal via array under pad (0.3 mm diameter).
- Solder Paste: Type 4 (20–38 µm particle size) recommended.
- Reflow Profile: Peak temp ≤ 245°C (Pb-free process).
- Inspection: X-ray (AXI) mandatory for void detection (<15% tolerance).



TUTTE LE CATEGORIE