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1156-BBGA, FCBGA

The 1156-BBGA, FCBGA (Flip Chip Ball Grid Array) is a surface-mount package designed for high-density and high-performance integrated circuits. Featuring a leadless design, high-density 1156-ball array, and flip-chip interconnect technology, it delivers superior thermal dissipation, reduced electrical inductance, and space-efficient integration. Typical dimensions are 35×35 mm with a 1.0 mm ball pitch and a 2.5 mm profile height, making it ideal for high-performance computing systems, networking infrastructure, and industrial automation controls. Its bottom-terminal contacts enable direct PCB thermal transfer, while RoHS-compliant materials ensure reliability in industrial environments.
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