TUTTE LE CATEGORIE1136-BBGA, FCBGA
- Immagine & Modelli
- Descrizione
- Unire Prezzo
- Quantità
- Operazione
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IC MECHANICAL SAMPLE
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1 + 10 + 25 + 50 + >=100 -
Minimo : 1 Stock : 215
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Solarspec Pin Hsg Panel Mnt
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1 + 10 + 25 + 50 + >=100 -
Minimo : 1 Stock : 201
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Virtex-5 LX FPGA 640 I/O 1136FCBGA
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1 + 10 + 25 + 50 + >=100 -
Minimo : 1 Stock : 574
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Virtex-5 LX FPGA 640 I/O 1136FCBGA
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1 + 10 + 25 + 50 + >=100 -
Minimo : 1 Stock : 901
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Virtex-5 FXT FPGA 640 I/O 1136FCBGA
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1 + 10 + 25 + 50 + >=100 -
Minimo : 1 Stock : 628
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Mechanical Sample IC
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1 + 10 + 25 + 50 + >=100 -
Minimo : 1 Stock : 50
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Virtex-5 SXT FPGA 640 I/O 1136FCBGA
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1 + 10 + 25 + 50 + >=100 -
Minimo : 1 Stock : 285
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XC5VLX85T-3FF1136C - NEW PRODUCT
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1 + 10 + 25 + 50 + >=100 -
Minimo : 1 Stock : 500
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Virtex-5 LXT Family 82944 Cells 65nm (CMOS) Technology 1V
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1 + 10 + 25 + 50 + >=100 -
Minimo : 1 Stock : 210
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XC5VLX85T-2FF1136I - NEW PRODUCT
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1 + 10 + 25 + 50 + >=100 -
Minimo : 1 Stock : 19
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XC5VLX85T-2FF1136C - NEW PRODUCT
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1 + 10 + 25 + 50 + >=100 -
Minimo : 1 Stock : 440
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FPGA Virtex?-5 LXT Family 46080 Cells 65nm Technology 1V 1136-Pin FCBGA
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1 + 10 + 25 + 50 + >=100 -
Minimo : 1 Stock : 2500
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XC5VLX50T-3FF1136C - NEW PRODUCT
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1 + 10 + 25 + 50 + >=100 -
Minimo : 1 Stock : 2500
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Virtex-5 LX FPGA 640 I/O 1136FCBGA
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1 + 10 + 25 + 50 + >=100 -
Minimo : 1 Stock : 700
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Virtex-5 Multi-Platform FPGAs, Package: 3FF1136C
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1 + 10 + 25 + 50 + >=100 -
Minimo : 1 Stock : 210
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FPGA Virtex?-5 LXT Family 110592 Cells 65nm Technology 1V 1136-Pin FCBGA
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1 + 10 + 25 + 50 + >=100 -
Minimo : 1 Stock : 82
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Virtex-5 LX FPGA 640 I/O 1136FCBGA
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1 + 10 + 25 + 50 + >=100 -
Minimo : 1 Stock : 3600
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2.5MM MALE CONTACT
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1 + 10 + 25 + 50 + >=100 -
Minimo : 1 Stock : 650
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Virtex-5 Multi-Platform FPGAs, Package: 2FF1136C
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1 + 10 + 25 + 50 + >=100 -
Minimo : 1 Stock : 500
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Virtex-5 Multi-Platform FPGAs, Package: 1FF1136CES
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1 + 10 + 25 + 50 + >=100 -
Minimo : 1 Stock : 215
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Virtex-5 FXT FPGA 640 I/O 1136FCBGA
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1 + 10 + 25 + 50 + >=100 -
Minimo : 1 Stock : 320
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FPGA Virtex?-5 FXT Family 65nm Technology 1V 1136-Pin FCBGA
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1 + 10 + 25 + 50 + >=100 -
Minimo : 1 Stock : 160
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Virtex-5 FXT FPGA 640 I/O 1136FCBGA
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1 + 10 + 25 + 50 + >=100 -
Minimo : 1 Stock : 800
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Virtex-5 FXT FPGA 640 I/O 1136FCBGA
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1 + 10 + 25 + 50 + >=100 -
Minimo : 1 Stock : 5896
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Q:What defines the physical structure of 1136-BBGA, FCBGA?
A:Key features include:
- Leadless bottom-mounted pads: Ensures direct PCB connectivity.
- Central thermal pad (80% coverage): Enhances heat dissipation.
- 1136-pin layout with staggered arrangement: Optimizes signal routing.
- 1.2 mm ultra-thin profile: Ideal for space-constrained designs. -
Q:Why choose 1136-BBGA, FCBGA over alternatives?
A:Critical advantages:
- Miniaturization: 40% smaller than traditional BGA packages.
- Thermal Performance: Direct PCB heat path reduces junction temperature by 25%.
- Electrical Benefits: Low-inductance design for high-speed signals.
- Reliability: Moisture-resistant substrate (MSL3 certified). -
Q:What are common technical specs?
A:Standard configurations (consult datasheets):
- Body Size: 35×35 mm
- Height: 1.2 mm
- Pin Pitch: 0.8 mm
- Material: Copper-alloy leads with organic substrate
- Temp Range: -40°C to +125°C -
Q:Where is 1136-BBGA, FCBGA typically applied?
A:Dominant use cases:
- High-performance computing: GPUs/CPUs (e.g., NVIDIA A100).
- Telecom infrastructure: 5G RF modules (e.g., Qualcomm X65).
- Automotive electronics: ADAS controllers (e.g., Tesla FSD). -
Q:What are critical assembly guidelines?
A:Key recommendations:
- PCB Design: Thermal vias (≥12) under the central pad.
- Solder Paste: Type 4 solder recommended for fine pitch.
- Reflow Profile: Peak temp ≤ 245°C (Pb-free process).
- Inspection: X-ray (AXI) mandatory for void detection.