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DSP
Il processore di segnale digitale (DSP) è un chip microprocessore specializzato, con la sua architettura ottimizzata per le esigenze operative dell'elaborazione del segnale digitale
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FPGA
Field-programmable gate array (FPGA) è un circuito integrato progettato per essere configurato da un cliente o da un progettista dopo la produzione
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RF
RF si riferisce a componenti elettronici che convertono la comunicazione del segnale radio in una determinata forma d'onda del segnale radio e la inviano attraverso la risonanza dell'antenna.
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Iot
Fornire supporto per prodotti e soluzioni per il mercato Internet of Things (IoT) wireless.I nostri componenti coprono 125K, 13.56M, Sub1G, 2.4G, NB-IoT, LoRa, ZIGBEE, WIFI
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MCU
Il microcontrollore Unital, noto anche come microcomputer a chip singolo o MCU, serve a ridurre la frequenza e le specifiche dell'unità centrale di elaborazione in modo appropriato
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Bluetooth 5 NB-IoT 5G Wireless charging-
ST introduces the 3 generation of STPOWER silicon carbide (SiC) MOSFET transisto
ST's latest generation of silicon carbide (SiC) power devices improves performance and reliability, maintaining its customary leadership position and making it more suitable for electric vehicles and energy-efficient industrial applications
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- Top 10 hot trends in semiconductor industry in 2022
- where will the industrial Internet of Things go 2022?
- Infineon provides safety certification for Qi 1.3 certified in-car wireless chargers
- How small are the transistors on a chip?
- Edge processing ramps up as computing cores continue to break through
- IoT Top10 semiconductor manufacturers Q3 earnings focus
Ultimi arrivi Di più >>
- CY7C028-15AI
- TB2930AHQ
- M5218AL
- TLE6251-3G
- MP1530DM-LF-Z
- FCCD143AEDC
- MCP23017T-E/SS
- XC6SLX45-L1CSG324I
- TGA2513-SM
- XC6SLX16-2CSG225I
- TS472IQT
- ATMEGA328P-AU
- IR2101
- FSA2567MPX
- XC6SLX25-2FTG256I
- XC6SLX25-3FTG256C
- XC6SLX25-3FTG256I
- XC6SLX16-3FTG256I
- AD632AD
- TN80C186EB20
- STM32F429VGT6
- XC3S250E-4PQG208C
- XC6SLX45-3CSG324I
- XC6SLX45-2CSG324I
- MAX485CSA+
- VSC8601XKN
- FPF2700MX
- MC68HC711E9CFNE2
- 30403
- SP3223EEY-L
- 10M08SAE144I7G
- MM74HC14M
- TGA2704-SM
- MC14011BD
- ST62T25CB6
- XC1736EPD8I
- XC6SLX16-3CSG324I
- CY7C1041DV33-10ZSXI
- AN8352UBK
- STM32F769BIT6
- 1AB15080AEAA
- LIF-MD6000-6KMG80I
- XC6SLX25-3CSG324I
- MK64FN1M0VLQ12
- L6374FP
- FPF2702MX
- MTD2035G
- BA10393F
- CD4023BE
- STM32H743VIT6
- AR8031-AL1B
- STM32F769BGT6
- XC6SLX4-2TQG144I
- MT48LC16M16A2P-75 IT:D TR
- CY7C1021DV33-10ZSXI
- MAX3051EKA+T
- HMC473MS8E
- TC7S04F
- LAN8710AI-EZK
- MAX14808ETK+
- XCR3064XL-10VQ44C
- LXT905LE
- STK401-080
- AR8035-AL1B
- 5M570ZT100C5N
- MT25QU01GBBB8E12-0SIT
- AR8236-AL1A
- AOZ1212AI
- AR8033-AL1A
- ISL12026IBZ
- QCA9880-BR4A
- GM5621-LF
- ATMEGA64-16AU
- AR8035-AL1A
- CXD3059AR
- SAB80C537N
- ITS716G
- MP4303
- XC6SLX45-2CSG324C
- LPC2366FBD100
Soluzioni applicative Di più >>
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Casa intelligente
Application scheme of 55V input buck chip based on MPS MP4570 in smart rearview mirror -
Gestione energetica
Smart car BMS power battery management integrated system solution based on NXP MC3371D and S32K144 -
Gestione energetica
High efficiency and high power density Type-C PD power supply scheme based on AOS AOZ7675QI and AOZ7658QI -
Gestione energetica
Smart car BMS power battery management integrated system solution based on NXP MC33771 and S32K144 -
Casa intelligente
Based on TI AM3358 Wilink8 Wi-Fi / BT streaming music sharing solution -
Gestione energetica
Low power consumption solar photovoltaic charging control board solution based on ST LM2904
